Aerospace Systems Engineering Research Center
Wang Xiaoliang
Post：Associate Professor
Office Phone：021-34207072
E-Mail：wangxiaoliang@sjtu.edu.cn
Office Address：Room A327, Aerospace Building
Professional experience
| Time | Office Units | Post |
|---|---|---|
| 10/2011 – present | Shanghai Jiao Tong University | Associate Professor |
| 11/2006-09/2011 | Shanghai Jiao Tong University | Assistant Research Fellow |
Educational background
| Time | Graduated School | Educational background |
|---|---|---|
| 2006 | Fluid mechanics, Shanghai Jiao Tong University, China | Ph.D. |
| 2003 | Safety Engineering, Taiyuan University of Technology | MSc. |
| 1998 | Safety Engineering, Taiyuan University of Technology | BSc. |
Research Interests
- Calculation aerodynamics and application
- Fluid-Structure couple computation and application
- Flight mechanics and control law design of rigid and flexible aircraft (large passenger aircraft and airship)
- Active and passive flow control design technology
- Aircraft parametric modeling, sensitivity analysis and optimization design
- Surrogate model of aerodynamics of parametric aircraft using high fidelity simulations and Neural Network
Selected publications
- Xiao-liang WANG, Fu-xin WANG and Ya-lin Li, “Aerodynamic Characteristics of High-Lift Devices with Downward Deflection of Spoiler,” Journal of Aircraft, Vol.48, No.2, pp.730-735, 2011.
- Mao-hua Zhang,Xiao-liang Wang* and Deng-ping DUAN.Panel method Predictions of Added Mass for Flexible Airship,The Aeronautical Journal,Volume 117,Number 1191,2013,pp519-531.
- Xiao-liang WANG*,“Effect of Ballonet Sloshing on the Stability Characteristics of an Airship,” AIAA Journal, Vol.54,pp.360-364, 2016.
- Ding Han, Xiao-liang Wang*, Lin Yan, Guozheng Yan, and Dengping Duan."Investigation of Airship Motion Sensitivity to Geometric Parameters", 55th AIAA Aerospace Sciences Meeting, AIAA SciTech Forum, 2017.
- Wei-Cheng Xie, Xiao-Liang Wang, Deng-Ping Duan and Ji-Wei Tang,Finite Element Simulation of the Microstructure of Stratospheric Airship Envelopes, AIAA Journal Vol 58, Issue 8.2020, pp3690-3699.
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